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PROBE HEADS, TEST SOCKETS, & CONNECTORS

We have a broad range of standard designs for most test platforms.  Additionally, Incavo engineers can design custom solutions per customer requirements.  

 

Our standard design process includes high frequency simulations on the probe pin and structure to confirm signal integrity prior to a build.  Once the design meets customer mechanical and electrical requirements, we can move forward with production. 
 

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Wafer Level

  • WLCSP: Probe Heads; Hand Testers; Hardware; Sockets

  • Full Wafer: Probe Pins; Carriers; Components

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Package Test

  • Test Platforms: Validation; Reliability; Burn-In (HTOL; HAST; and related tests); System; Final

  • Packages: CSP; QFN; QFP; POP; TSOP; LGA; BGA; PGA 

  • Socket Types:  Open Top; Clamshell; Coaxial; POP

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Connectors

  • Interposers: Connectors for Board to Board and Space Transformer

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Product Pitch Range:  >1mm ~ 0.10mm

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